Customer Engineering group will be responsible for technically supporting customers. Activities will include direct support such as answering questions, debugging customer hardware which may involve test report generation and scripting for automated data collection, generation of education material such as application notes.
1. Plan and execute device verification and characterization
2. Develop and carry out experiments to prototype new technologies and system architectures
3. Design and implement test automation to characterize and release into production a variety of MEMS based, mixed-signal timing devices
4. Develop and transfer algorithms to final test/production environments
The Probe Engineer is responsible for sustaining probing activities including capacity expansion, yield enhancement, process advancement, quality improvement and cost reduction activities. The Probe Engineer will work closely with the worldwide Operations and Systems team to develop and deploy production test solutions.
The Semiconductor Packaging Engineering Manager will report to Director of Packaging and is responsible for NPI planning across R and D and OPS, Production Sustaining, and qualification of unique custom packaging technology for company’s revolutionary MEMS-based timing products.
Responsibilities include managing and leading a team of engineers in Taiwan for packaging materials research and development, process development and optimization, package qualification, release-toproduction, and production sustaining. In addition, he/she will be responsible for managing local and overseas vendors in new package development activities including DoEs (Design-of-Experiments).
The Semiconductor Package Engineering manager will have a highly visible role within the company, working cross-functionally to ensure system-level performance of company’s ultra-stable timing products.
1. Characterize and bring into production mixed-signal timing devices incorporating MEMS resonators
2. Plan and execute device verification and characterization
3. Perform engineering failure analysis to root cause product issues
