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Sr. Package Development Engineer and Manager
Sr. Package Development Engineer and Manager
He/she will be interface with local and overseas vendors in new package development activities.
詳細介紹
1) Develop packages and drive engineering builds at vendors within Asia.
2) Design custom IC packages incorporating timing products components.
3) Assist with new package qualification and release-to-production.
4) Lead troubleshooting activities related to package design or performance.
Qualifications & Requirements:
1) BS in Mechanical/Electrical Engineering, Material Science or equivalent.
2) Expertise in semiconductor IC packaging technology and assembly process methodologies.
3) Experience with mechanical and thermal design.
4) Experience in WLCSP package and assembly development.