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Packaging Engineering Manager

Packaging Engineering Manager

The Semiconductor Packaging Engineering Manager will report to Director of Packaging and is responsible for NPI planning across R and D and OPS, Production Sustaining, and qualification of unique custom packaging technology for company’s revolutionary MEMS-based timing products.
Responsibilities include managing and leading a team of engineers in Taiwan for packaging materials research and development, process development and optimization, package qualification, release-toproduction, and production sustaining. In addition, he/she will be responsible for managing local and overseas vendors in new package development activities including DoEs (Design-of-Experiments).
The Semiconductor Package Engineering manager will have a highly visible role within the company, working cross-functionally to ensure system-level performance of company’s ultra-stable timing products.
詳細介紹
Responsibilities:
1. Manage, Lead, Train and Develop a Team of Packaging Engineers in Taiwan
2. Function as NPI planner for Packaging R and D and OPS.
3. Help train engineers with Build plans and risk analysis
4. Implements PLC business processes across projects owned by Taiwan team.
5. Work with OSATs to design and develop semiconductor packages incorporating MEMS components
6. Identify new materials, assist with material models and characterization methodologies
7. Optimize recipes and processes to improve device performance
8. Manage package DoEs
9. Assist with thermal, mechanical, and electrical simulations (Preferred)
10. Lead new package qualification and release-to-production activities
11. Lead troubleshooting activities related to package design or performance

Requirements:
1. BS or MS in Mechanical Engineering, Material Science, or equivalent.
2. 10+ Years in Packaging Engineering with at least 3+ years as a manager.
3. Very good communication skills to be able to work with work wide cross functional teams.
4. Ability to work efficiently and effectively through ambiguity.
5. Hands-on experience in semiconductor IC packaging technology and methodology.
6. Understanding of semiconductor packaging materials, such as epoxies, polymers, and solders.
7. Hands-on experience with CAD software (AutoCAD preferred)
8. Knowledge of Design of Experiments (DoE)
9. Ability to manage OSATs and work independently to complete complex projects in a timely manner.