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Packaging Engineering Sr Engineer

Packaging Engineering Sr Engineer

The Semiconductor Packaging Engineering Sr Engineer will report to Director of Packaging and is
responsible for NPI planning across RD and OPS, Production Sustaining, and qualification of unique
custom packaging technology for biz’s revolutionary MEMS-based timing products. Responsibilities
packaging materials research and development, process development and optimization, package qualification, release-to-production, and production sustaining. In addition, he/she will be responsible for managing local and overseas vendors in new package development activities including DoEs (Design-of-Experiments).
詳細介紹
Responsibilities:
1) Function as NPI planner for Packaging RD and OPS.
2) Help train engineers with Build plans and risk analysis.
3) Implements PLC business processes across projects owned by Taiwan team.
4) Work with OSATs to design and develop semiconductor packages incorporating MEMS components.
5) Identify new materials, assist with material models and characterization methodologies.

Requirements:
1) BS or MS in Mechanical Engineering, Material Science, or equivalent.
2) 8+ Years in Packaging Engineering of experience working with OSATs to bring new IC packages to production.
3) Hands-on experience in semiconductor IC packaging technology and methodology.
4) Understanding of semiconductor packaging materials, such as epoxies, polymers, and solders.
5) Ability to manage OSATs and work independently to complete complex projects in a timely manner.